Our Chapter Leaders

President:
Ter Chuen Loy
Kyzen Corporation Sdn. Bhd.

Phone: 019-579-7877

Email Address:
tc_loy@kyzen.com

Vice President:
Peng Wah Yeoh
Chiptronics (M) Sdn. Bhd.

Phone: 604-659-8888

Email Address:
pwyeoh@chiptronics.com.my

Secretary:
Yee May Koh
Keysight Technologies (M) Sdn. Bhd.

Treasurer:
Chee Wei Ooi
Plexus Manufacturing Solutions

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Chapter News

Global SMT & Packaging News

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Chapter News

Dear SMTA Penang Chapter fellow members,

Good day!

The results of the SMTA Chapter Officer Elections through online polling are out. I am honored to be elected the new term’s President.

I am also delighted to announce the new committee members for the coming 2 years. Please join me in welcoming the following individuals as the new SMTA Penang Chapter committee.

President Ter Chuen Loy Kyzen Corporation Sdn. Bhd.
Vice President Peng Wah Yeoh Chiptronics (M) Sdn. Bhd.
Secretary Yee May Koh Keysight Technologies (M) Sdn. Bhd.
Treasurer Chee Wei Ooi Plexus Manufacturing Solutions
VP of Technical Programs Kong Hui Lee Cisco Systems (Malaysia) Sdn Bhd
VP of Membership AK Tan Jabil Circuit Sdn. Bhd.
Advisor Mei-Ming Khaw Keysight Technologies (M) Sdn. Bhd.
Committee Yaw Sing Chuah Koki Material Sdn. Bhd.
Committee Kok Liang Lim Plexus Manufacturing Sdn. Bhd.
Committee David Vetharudge LISTECH TECHNOLOGY SDN BHD
Auditor Soon Tit Lai MAGS Sdn. Bhd.
Auditor Ronnie Choon Kiang Teoh Kyzen Corporation Sdn. Bhd.

I look forward in working together with the committee to organize events to strengthen our knowledge and networking among members.

Best regards,

TC Loy

President, SMTA Penang Chapter


Global SMT & Packaging News

2020 Events

Description Date Venue Remarks
FREE Webinar: Optimizing Conformal Coating Coverage For Improved Environmental Corrosion Protection 27th March, 2020 / Friday (10:00) UTC+8
(26th March 22:00 US Easter Time UTC-4)
Webinar Contact KH Lee at konlee@cisco.com with questions or comments.
FREE Webinar: The Effects of Surface Finish on Solder Paste Performance - the Sequel 6th Nov, 2020 / Friday (11:00) UTC+8
(5th Nov 22:00 US Colorado (20:00) UTC-7)
Webinar Contact KH Lee at konlee@cisco.com with questions or comments.

FREE Webinar

SMTA Penang

Optimizing Conformal Coating Coverage For Improved Environmental Corrosion Protection

Venue: Webinar
Date: 27th March, 2020 / Friday (10:00) UTC+8
(26th March 22:00 US Easter Time UTC-4)

Presenter: Chen Xu, PH.D, Nokia Bell Lab.

Overview:
Headshot of Dr. Chen Xu Conformal coating is widely used to provide environmental protection for electronics in challenging environments with high relative humidity, corrosive gas and dust concentration as well as in coastal environments.

Although the physical and chemical properties of conformal coatings are often characterized and studied, very little research has been done to understand the effectiveness of conformal coating in protecting electronics in various harsh environments. This work examines the effect of conformal coating coverage, especially the coating thickness, on the environmental protection of the conformal coating. Results of optimizing coating coverage and quality control will also be presented.

Get More Details.

FREE Webinar

SMTA Penang

The Effects of Surface Finish on Solder Paste Performance - The Sequel

Venue: Webinar
Date: 6th Nov, 2020 / Friday (11:00) UTC+8
(5th Nov 22:00 US Colorado (20:00) UTC-7)

Presenter: Tony Lentz, FCT Assembly

Overview:

This is a second study on how solderable surface finish affects solder paste performance in the surface mount process (SMT). The first study was presented at SMTA International 2018 and included print, reflow and voiding data on 6 different surface finishes run with 4 different solder pastes. The performance of the surface finish - solder paste combinations were scored and ranked and recommendations given for optimal performance.

This work explores some of the surface finish & solder paste combinations in more detail with an expanded set of SMT parameters. Three surface finishes were studied including electroless nickel immersion gold (ENIG), organic solderability preservative (OSP), and immersion silver (ISilver). Two solder pastes were used including a no clean SAC305 solder paste and a water soluble SAC305 solder paste. Three different reflow conditions were tested including a ramp-to-spike (RTS) profile, a ramp-soak-spike (RSS) profile, and simulation of the double-sided surface mount process by reflowing two times through a RTS profile. Print speeds were varied at 25, 50, and 100 mm/second and printed solder paste volumes were measured. Reflow performance was measured and quantified including wetting, solder balling, and graping data. Quad flat no lead (QFN) components were placed and voiding was measured in the solder joints of the QFN thermal pads.

All of the test results, including data from the first study, are summarized, compared and contrasted. Discussion of the strengths and weaknesses of each combination of surface finish and solder paste are given with respect to the various SMT parameters. Recommendations are made for optimal combinations of surface finish and solder paste.

Get More Details.

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Andelyn Teo
Email: admin@smtapenang.com.my
Phone: 604-643-3817

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