Dear SMTA Penang Chapter fellow members,
The results of the SMTA Chapter Officer Elections through online polling are out. I am honored to be elected the new term’s President.
I am also delighted to announce the new committee members for the coming 2 years. Please join me in welcoming the following individuals as the new SMTA Penang Chapter committee.
I look forward in working together with the committee to organize events to strengthen our knowledge and networking among members.
Best regards,TC Loy
President, SMTA Penang Chapter
Global SMT & Packaging News
Optimizing Conformal Coating Coverage For Improved Environmental Corrosion Protection
Presenter: Chen Xu, PH.D, Nokia Bell Lab.
Although the physical and chemical properties of conformal coatings are often characterized and studied, very little research has been done to understand the effectiveness of conformal coating in protecting electronics in various harsh environments. This work examines the effect of conformal coating coverage, especially the coating thickness, on the environmental protection of the conformal coating. Results of optimizing coating coverage and quality control will also be presented.
The Effects of Surface Finish on Solder Paste Performance - The Sequel
Presenter: Tony Lentz, FCT Assembly
This is a second study on how solderable surface finish affects solder paste performance in the surface mount process (SMT). The first study was presented at SMTA International 2018 and included print, reflow and voiding data on 6 different surface finishes run with 4 different solder pastes. The performance of the surface finish - solder paste combinations were scored and ranked and recommendations given for optimal performance.
This work explores some of the surface finish & solder paste combinations in more detail with an expanded set of SMT parameters. Three surface finishes were studied including electroless nickel immersion gold (ENIG), organic solderability preservative (OSP), and immersion silver (ISilver). Two solder pastes were used including a no clean SAC305 solder paste and a water soluble SAC305 solder paste. Three different reflow conditions were tested including a ramp-to-spike (RTS) profile, a ramp-soak-spike (RSS) profile, and simulation of the double-sided surface mount process by reflowing two times through a RTS profile. Print speeds were varied at 25, 50, and 100 mm/second and printed solder paste volumes were measured. Reflow performance was measured and quantified including wetting, solder balling, and graping data. Quad flat no lead (QFN) components were placed and voiding was measured in the solder joints of the QFN thermal pads.
All of the test results, including data from the first study, are summarized, compared and contrasted. Discussion of the strengths and weaknesses of each combination of surface finish and solder paste are given with respect to the various SMT parameters. Recommendations are made for optimal combinations of surface finish and solder paste.
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